{"id":87691,"date":"2026-08-05T13:30:00","date_gmt":"2026-08-05T10:30:00","guid":{"rendered":"https:\/\/www.indir.com\/haber\/?p=87691"},"modified":"2026-08-05T12:41:40","modified_gmt":"2026-08-05T09:41:40","slug":"intelden-tsmcye-karsi-emib-t-hamlesi","status":"publish","type":"post","link":"https:\/\/www.indir.com\/haber\/intelden-tsmcye-karsi-emib-t-hamlesi\/","title":{"rendered":"Intel’den TSMC’ye Kar\u015f\u0131 EMIB-T Hamlesi"},"content":{"rendered":"\n

Intel, geli\u015fmi\u015f \u00e7ip paketleme pazar\u0131nda TSMC’nin CoWoS teknolojisine kar\u015f\u0131 rekabeti b\u00fcy\u00fct\u00fcyor. Tam boyutlu ara katmanlar yerine paket alt tabakas\u0131na g\u00f6m\u00fclen k\u00fc\u00e7\u00fck silikon k\u00f6pr\u00fclerden yararlanan EMIB-T, tasar\u0131ma ba\u011fl\u0131 olarak paketleme maliyetini y\u00fczde 40 ila 50 azaltabiliyor. Teknolojinin y\u00fcksek hacimli \u00fcretimi ve m\u00fc\u015fteri sevkiyatlar\u0131 i\u00e7in 2027 takvimi belirlendi.<\/p>\n\n\n\n

EMIB-T Teknolojisi Nas\u0131l \u00c7al\u0131\u015f\u0131yor?<\/h2>\n\n\n\n

A\u00e7\u0131l\u0131m\u0131 Embedded Multi-die Interconnect Bridge olan EMIB, farkl\u0131 \u00fcretim s\u00fcre\u00e7lerinden \u00e7\u0131kan i\u015flem, bellek ve giri\u015f-\u00e7\u0131k\u0131\u015f yongalar\u0131n\u0131n ayn\u0131 paket \u00fczerinde birle\u015ftirilmesini sa\u011fl\u0131yor. Teknolojinin temelinde organik paket alt tabakas\u0131na g\u00f6m\u00fclen k\u00fc\u00e7\u00fck silikon k\u00f6pr\u00fcler bulunuyor. Bu k\u00f6pr\u00fcler yaln\u0131zca yongalar\u0131n y\u00fcksek h\u0131zl\u0131 ileti\u015fim kurmas\u0131 gereken noktalara yerle\u015ftiriliyor ve mant\u0131k yongalar\u0131 ile HBM bellekler aras\u0131nda y\u00fcksek yo\u011funluklu ba\u011flant\u0131lar kuruluyor. B\u00f6ylece tam boyutlu bir silikon ara katman\u0131n getirdi\u011fi maliyet ve alan dezavantajlar\u0131 ortadan kalk\u0131yor. Standart EMIB, 2017’den bu yana seri \u00fcretimde kullan\u0131l\u0131yor.<\/p>\n\n\n\n

Varyantlar Aras\u0131ndaki Fark Ne?<\/h2>\n\n\n\n

\u015eirketin paketleme ailesinde standart s\u00fcr\u00fcm\u00fcn yan\u0131 s\u0131ra EMIB-M ve EMIB-T se\u00e7enekleri bulunuyor. EMIB-M, silikon k\u00f6pr\u00fcye entegre edilen metal-yal\u0131tkan-metal kapasit\u00f6rlerden yararlan\u0131yor. EMIB-T ise k\u00f6pr\u00fcye TSV ad\u0131 verilen dikey silikon ba\u011flant\u0131lar\u0131 ekliyor. Bu ba\u011flant\u0131lar g\u00fcc\u00fcn paket alt tabakas\u0131ndan do\u011frudan \u00fcstteki yongalara ta\u015f\u0131nmas\u0131na, daha k\u0131sa g\u00fc\u00e7 yollar\u0131 kurulmas\u0131na ve y\u00fcksek ak\u0131m gerektiren yapay zeka h\u0131zland\u0131r\u0131c\u0131lar\u0131n\u0131n beslenmesine imkan veriyor. TSV destekli yap\u0131, HBM bellekler ile farkl\u0131 i\u015flevlere sahip yonga par\u00e7alar\u0131n\u0131n 2D, 2.5D ve 3D d\u00fczenlerde ayn\u0131 pakette bir araya getirilmesini de kolayla\u015ft\u0131r\u0131yor. Intel, tek bir pakette \u00e7oklu kilovatl\u0131k \u00e7\u00f6z\u00fcmler sunabildi\u011fini belirtiyor.<\/p>\n\n\n\n

\"Tsmc<\/figure>\n\n\n\n

Teknoloji Hangi Performans De\u011ferlerine Ula\u015f\u0131yor?<\/h2>\n\n\n\n

\u015eirket, 25 mikrometre ba\u011flant\u0131 aral\u0131\u011f\u0131na kadar \u00f6l\u00e7eklenen tasar\u0131mlarla 120 x 120 milimetrelik paketler ve dokuzdan fazla retik\u00fcl alan\u0131na kar\u015f\u0131l\u0131k gelen silikon i\u00e7eri\u011fi sergiledi. Teknoloji ayr\u0131ca HBM4e ba\u011flant\u0131lar\u0131nda 12 Gb\/sn’nin, UCIe arabirimlerinde ise 64 Gb\/sn’nin \u00fczerine \u00e7\u0131kabiliyor.<\/p>\n\n\n\n

Maliyet Avantaj\u0131 Nereden Geliyor?<\/h2>\n\n\n\n

TSMC’nin CoWoS ailesi, yongalar ve HBM bellekler aras\u0131ndaki ba\u011flant\u0131lar\u0131 geni\u015f bir silikon ya da yeniden da\u011f\u0131t\u0131m katman\u0131 \u00fczerinden kuruyor. Paket boyutu b\u00fcy\u00fcd\u00fck\u00e7e bu ara katman\u0131n \u00fcretim maliyeti, malzeme kullan\u0131m\u0131 ve mekanik karma\u015f\u0131kl\u0131\u011f\u0131 da art\u0131yor. Yeni \u00e7\u00f6z\u00fcm ise geni\u015f bir ara katman\u0131 paketin tamam\u0131na yaymak yerine k\u00fc\u00e7\u00fck k\u00f6pr\u00fcleri yaln\u0131zca gerekli b\u00f6lgelere yerle\u015ftiriyor. B\u00fcy\u00fck yapay zeka h\u0131zland\u0131r\u0131c\u0131lar\u0131nda hesaplanan y\u00fczde 40 ila 50’lik fark bu yap\u0131sal ayr\u0131mdan kaynaklan\u0131yor. Ortaya \u00e7\u0131kan tasarruf, m\u00fc\u015fterilerin \u00fcretim s\u00fcre\u00e7lerinde farkl\u0131 alanlara yat\u0131r\u0131m yapabilmesine imkan tan\u0131yor.<\/p>\n\n\n\n

\u00dcretim Takvimi Nas\u0131l Ilerliyor?<\/h2>\n\n\n\n

Y\u00fcksek hacimli \u00fcretim 2027’de ba\u015flayacak. Paket alt tabakas\u0131 \u00fcretiminde Intel ile \u00e7al\u0131\u015fan Unimicron, Ibiden ve Shinko Electric Industries ilk a\u015famada yakla\u015f\u0131k y\u00fczde 50 \u00fcretim verimi \u00f6ng\u00f6r\u00fcyor. Unimicron’un bu teknolojiye ay\u0131rd\u0131\u011f\u0131 kaynak, \u015firketin toplam yat\u0131r\u0131m\u0131n\u0131n y\u00fczde 10’undan daha az\u0131n\u0131 olu\u015fturuyor ve bu tutar\u0131n yaln\u0131zca y\u00fczde 15 ila 20’lik b\u00f6l\u00fcm\u00fc \u00f6zel \u00fcretim ekipmanlar\u0131na gidiyor. Intel ise teknoloji do\u011frulama s\u00fcrecindeki verim ve g\u00fcvenilirlik hedeflerine ula\u015ft\u0131\u011f\u0131n\u0131 a\u00e7\u0131klad\u0131. \u015eirketin a\u00e7\u0131klad\u0131\u011f\u0131 de\u011ferler genel paketleme platformunun do\u011frulama sonu\u00e7lar\u0131n\u0131, alt tabaka \u00fcreticilerinin y\u00fczde 50 seviyesi ise yeni \u00fcretim hatlar\u0131n\u0131n ba\u015flang\u0131\u00e7 verimini kaps\u0131yor.<\/p>\n\n\n\n

Hangi \u015eirketler Ge\u00e7i\u015fi De\u011ferlendiriyor?<\/h2>\n\n\n\n

Maliyet fark\u0131, \u00f6zel yapay zeka yongalar\u0131 geli\u015ftiren \u015firketlerin bu teknolojiyi mevcut paketleme planlar\u0131na eklemesini sa\u011flad\u0131. Broadcom ve Meta, baz\u0131 ASIC projelerinde CoWoS yerine Intel’in EMIB ailesini kullanma se\u00e7ene\u011fini de\u011ferlendiriyor. Hen\u00fcz kamuya a\u00e7\u0131klanan kesin bir \u00fcretim anla\u015fmas\u0131 bulunmuyor, ancak \u015firket geli\u015fmi\u015f paketleme m\u00fc\u015fterilerinden olu\u015fan sipari\u015f havuzunun b\u00fcy\u00fcd\u00fc\u011f\u00fcn\u00fc do\u011frulad\u0131. Ge\u00e7i\u015f yapan m\u00fc\u015fterilerin ayn\u0131 paketleme altyap\u0131s\u0131n\u0131 \u00fc\u00e7 \u00fcr\u00fcn nesli boyunca kullanabilece\u011fi hesaplan\u0131yor.<\/p>\n\n\n\n

CoWoS Taraf\u0131nda Sorun Var M\u0131?<\/h2>\n\n\n\n

CoWoS, Nvidia ve AMD’nin yapay zeka h\u0131zland\u0131r\u0131c\u0131lar\u0131 ile bulut \u015firketlerinin \u00f6zel i\u015flemcilerinde kullan\u0131lan temel paketleme \u00e7\u00f6z\u00fcmlerinden biri olmay\u0131 s\u00fcrd\u00fcr\u00fcyor. Ancak yapay zeka i\u015flemcilerine y\u00f6nelik talep, TSMC’nin CoWoS hatlar\u0131nda uzun s\u00fcredir kapasite bask\u0131s\u0131 olu\u015fturuyor. \u00dcretim kapasitesi geni\u015fletilse de k\u00fcresel 2.5D paketleme a\u00e7\u0131\u011f\u0131n\u0131n ancak 2027’den itibaren kademeli olarak azalmas\u0131 bekleniyor. Paket boyutlar\u0131n\u0131n b\u00fcy\u00fcmesi mekanik sorunlar\u0131 da g\u00fcndeme getirdi. Nvidia’n\u0131n Rubin Ultra i\u00e7in de\u011ferlendirilen d\u00f6rt yongal\u0131 tek paket tasar\u0131m\u0131, yakla\u015f\u0131k 7,5 ila 8 retik\u00fcl b\u00fcy\u00fckl\u00fc\u011f\u00fcne ula\u015ft\u0131\u011f\u0131 i\u00e7in \u00fcretim verimi, maliyet ve alt tabaka b\u00fck\u00fclmesi sorunlar\u0131yla kar\u015f\u0131la\u015ft\u0131. Farkl\u0131 y\u00f6nlere do\u011fru olu\u015fan b\u00fck\u00fclme, yongalar\u0131n alt tabakayla d\u00fczg\u00fcn temas kurmas\u0131n\u0131 zorla\u015ft\u0131rd\u0131 ve tasar\u0131m\u0131n \u00e7ift yongal\u0131 d\u00fczene y\u00f6nelmesine neden oldu.<\/p>\n","protected":false},"excerpt":{"rendered":"

Intel, geli\u015fmi\u015f \u00e7ip paketleme pazar\u0131nda TSMC’nin CoWoS teknolojisine kar\u015f\u0131 rekabeti b\u00fcy\u00fct\u00fcyor. Tam boyutlu ara katmanlar yerine paket alt tabakas\u0131na g\u00f6m\u00fclen k\u00fc\u00e7\u00fck silikon k\u00f6pr\u00fclerden yararlanan EMIB-T, tasar\u0131ma ba\u011fl\u0131 olarak paketleme maliyetini y\u00fczde 40 ila 50 azaltabiliyor. Teknolojinin y\u00fcksek hacimli \u00fcretimi ve m\u00fc\u015fteri sevkiyatlar\u0131 i\u00e7in 2027 takvimi belirlendi. EMIB-T Teknolojisi Nas\u0131l \u00c7al\u0131\u015f\u0131yor? A\u00e7\u0131l\u0131m\u0131 Embedded Multi-die Interconnect Bridge […]<\/p>\n","protected":false},"author":72,"featured_media":87692,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[47,1],"tags":[12263],"class_list":["post-87691","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-donanim","category-teknoloji","tag-intel-tsmc-rekabeti"],"_links":{"self":[{"href":"https:\/\/www.indir.com\/haber\/wp-json\/wp\/v2\/posts\/87691","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.indir.com\/haber\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.indir.com\/haber\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.indir.com\/haber\/wp-json\/wp\/v2\/users\/72"}],"replies":[{"embeddable":true,"href":"https:\/\/www.indir.com\/haber\/wp-json\/wp\/v2\/comments?post=87691"}],"version-history":[{"count":1,"href":"https:\/\/www.indir.com\/haber\/wp-json\/wp\/v2\/posts\/87691\/revisions"}],"predecessor-version":[{"id":87694,"href":"https:\/\/www.indir.com\/haber\/wp-json\/wp\/v2\/posts\/87691\/revisions\/87694"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.indir.com\/haber\/wp-json\/wp\/v2\/media\/87692"}],"wp:attachment":[{"href":"https:\/\/www.indir.com\/haber\/wp-json\/wp\/v2\/media?parent=87691"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.indir.com\/haber\/wp-json\/wp\/v2\/categories?post=87691"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.indir.com\/haber\/wp-json\/wp\/v2\/tags?post=87691"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}